Inductance packaging style dimensions product symbol shapes and dimensions recommended pattern sdt 0402 land pattern c b a d dimensions in mm a 6. Example packaging methods taping standard quantity taping reel carrier tape unit. The land pattern images are shown in the nominal density level. The following drawings are based on ipcsm782 surfacemount design and land pattern standard.
So, i am trying to figure out what pad size to use for 0603 imperial smd capacitors. Crt series thin film precision chip resistors bourns products have not been speci. Ipc 2215 sanders road northbrook, illinois 6006265 tel 847 509. V v voltage across the device measured at 1ma dc current. An10778 pcb layout guidelines for nxp mcus in bga packages. As for packaging methods, land pattern, soldering conditions and safety precautions.
Land pattern solder resist a c b b a b c wiring pattern copper trace land pattern solder resist an example of a land pattern for low resistance value chip resistors is shown below. C p device capacitance measured with 1 vrms at 1mhz. Rncp series high power antisulfur thin film chip resistor stackpole electronics, inc. Nc s1 maam010237 sp2 nc out8 vc broadband catv 8way. Standard chip resistors rc011121 sizes 1206, 0805, 0603. Mlcc tantalum chip substitution common footprints mouser. Assembly guidelines for qfn quad flat nolead and son. Land pattern recommendations danielnoel abstract the following land pattern recommendations are provided as guidelines for board layout and assembly purposes. Sdt0402t6r8mn chilisin ssl0402 sdt0804t151mn sdt0402t221mn text. According to ipc7351 dimension and tolerance of land pattern shall be defined by pcb designer. Reference standard iec 60115 8,jis c 5201 8,jeita rc24c aecq200 compliant except erjxg rohs compliant as for packaging methods, land pattern, soldering conditions and safety precautions, please see data files. Land pattern, soldering conditions and safety precautions. The datasheet for the particular capacitors i plan to use provides part dimensions but does not recommend a land pattern. Low noise figure high gain broadband performance low current consumption single positive bias pbfree rohs compliant 4x4qfn package electrical performance v dd 4.
V u b punched paper taping 3e, 6e, 8e only embossed taping 14, 12 only bulk case 3e, 6e only packaging a b t w l n explanation of part numbers erj2r, 3e, 6e, 8e, 14, 12 series, 1 % type e 1 r 2 j 3 2 4 r 5 k 6 f 7 1 8 0 9 2 10 x 11 product code thick film chip resistors size, power rating type. Marking code y nil marking value marking on black side no marking resistance tolerance code j 0. The land pattern images are shown in the nominal density level non. Metal film thermosensitive chip resistors 0402, 0603, 0805. Thick film chip resistors 01005, 0201, 0402, 0603, 0805, 1206.
Silicon esd protection device lxesxxt series document no. Surface mount design and land pattern standard developed by the surface mount land patterns subcommittee 1 of the printed board design committee 110 of ipc users of this standard are encouraged to participate in the development of future revisions. Vc maximum peak voltage across the varistor measured at 8 20us waveform and 1a pulse current. These dimensions may be modified based on user equipment capability or fabrication criteria. Googling, i found that the land pattern is typically parameterized as xpad width, ypad height, ccentertocenter pad spacing. Maximum peak current across the varistor with 8 20. These drawings are for reference only vishay thin film recommends that the user contacts their pc board supplier for actual land patterns required. C1, c4 270 pf 0402 l1, l2 33 nh 0402 c2, c3, c5, c6, c10 10 nf 0402 r1, r2 82. Im particularly confused about this problem as id made a lot of effort with tracking on the 0402 caps to make sure the thermal paths to each pad were fairly equal so im pretty sure thats not the problem, im fairly convinced its the land pattern thats causing the issue. Metal film chip resistors, high reliability type 0402, 0603. For sot23 5lead and to263 3 or 5lead packages, refer to land patterns shown. The rlp registered land pattern number is a three digit number with a set of numbers assigned to land patterns for a particular family of components. Ezaeg2a50ax esd suppressor components datasheet pdf data sheet free from datasheet data sheet search for integrated circuits ic, semiconductors and other electronic components such as resistors, capacitors, transistors and diodes. Iec 60115 8, jis c 5201 8, eiaj rc24b rohs compliant explanation of part numbers erjxgn, 1gn, 2ge, 3ge, 6ge, 8ge, 14, 12, 12z, 1t series, 5 % type when omitted, the rest of the pn factors shall be moved up respectively.
Low resistance value chip resistorscurrent sensing resistors. Erjl1w a an example of a land pattern for low resistance value chip, copper trace b b wiring pattern. The original number assigned to a particular component, uses that analysis shown for the specific section. Metal film thin film chip resistors, high reliability type. Thick film chip resistors 01005, 0201, 0402, 0603, 0805. Recommended land pattern safety precautions the following are precautions for individual products. Recommended land pattern design for network chip is shown below. Scv007 e b a f c dg preferred direction during wave soldering solder land solder paste pattern solder resist pattern occupied area tracks e available area for tracks underneath the chip fig. These recommendations cover the following texas instruments packages. An example of a land pattern for chip resistor array, metal film chip resistor array, antisulfurated, u1d erjs1tu1t exb14v. An1902 assembly guidelines for qfn quad flat nolead and son small outline nolead packages rev.
Anexample of a land pattern to metal film thermosensitive chip resistors is shown below. Library expert surface mount families pcb libraries, inc. This technical note provides sample land patterns for vishay dale thin film smt resistive products. Maximum dc working voltage clamping voltage v c measuring source. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. Possible occurrence of tombstones andor shifting on the land patterns of the circuit board. If i use smallest pattern 0402 it calculates out to about. Low resistance value chip resistorscurrent sensing. Rs pro rs series thick film surface mount fixed resistor 0402. An10778 pcb layout guidelines for nxp mcus in bga packages rev. The tmp61 is currently available in a 0402 footprintcompatible x1son package, a 0603 footprintcompatible sot5x3 package, and a 2pin throughhole to92s package. Resistive product solutions reel specifications peeloff force specifications rncp peeloff force of paper and blister tape is in accordance with jisc5202, that is, 0. Vc, maximum peak voltage across the varistor measured at a specified pulse current and waveform. Here are my recommendations for the largest 0402 1005 chip capacitor land pattern and its in the.
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